Recent Developments in Semiconductor Wafer Fabrication: Materials, Processes, and Innovations

Abstract

The semiconductor industry plays a critical role in modern electronics, with semiconductor wafer fabrication being a fundamental process in integrated circuit (IC) production. This review explores the key materials, fabrication processes, and recent advancements in semiconductor wafer manufacturing. The study highlights the importance of materials such as silicon, gallium arsenide, and silicon carbide, along with emerging alternatives that enhance device performance. Additionally, advanced lithography techniques, including extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography, are discussed for their impact on miniaturization and transistor density. The paper also examines challenges in wafer fabrication, such as defect detection, process optimization, and sustainability concerns. Future research directions emphasize AI-driven manufacturing, automation, and the development of eco-friendly processes to improve efficiency and reduce environmental impact. The study sheds light on the consequences of the changing semiconductor wafer production environment for the future of electronics manufacturing.