The Role of Advanced Materials in Enhancing Thermal Management for Mobile Devices
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Abstract
The rapid advancement of mobile devices, driven by increasingly powerful processors and compact designs, has led to a significant challenge in managing the heat generated during intensive operations. Effective thermal management has become crucial not only for maintaining optimal performance but also for ensuring the longevity and reliability of these devices. The increasing need for effective heat dissipation in high-performance mobile devices is addressed in this article by examining the most recent approaches to thermal management, with an emphasis on active and passive cooling methods. Potentially improved thermal efficiency is investigated by looking at key material advances such as self-healing polymers, diamond-like carbon coatings, liquid metals, and others. Furthermore, there are potential methods to improve heat transfer capacities by the use of nanomaterials including phase-change materials, graphene, and aerogels. The paper further discusses the role of AI-driven dynamic thermal management systems that adapt in real time to the device's operational state. The study also identifies the main heat sources within mobile devices and the associated challenges, such as mechanical stack-up and space limitations, while proposing future strategies for overcoming these obstacles. The purpose of this study is to survey the current status of thermal management systems and to speculate on possible future breakthroughs in cooling technologies for mobile devices by making use of existing innovations.
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